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Device enables lowest cost, smallest form factor and highest performance for mobile devices

TriLumina, the leading developer of flip chip vertical cavity surface-emitting laser (VCSEL) technology for 3D sensing, announces the launch of the world’s first 3 W surface-mount, flip-chip, back-emitting VCSEL array without the need for a package submount or bond wires for mobile 3D sensing cameras. This new VCSEL-on-Board (VoB) technology enables higher performance, smaller size and lower costs, and simplifies time-of-flight (ToF) camera supply chains as compared to conventional VCSELs for 3D sensing.

Additional information can be found on the TriLumina website press release.